Heat dissipating device for an integrated circuit chip

Details Heat dissipating device for an integrated circuit chip Heat dissipating device for an integrated circuit chip

2005-12-20

2005-12-20

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S707000, C257S717000, C257S718000, C257S719000, C165S080300, C165S185000

Reexamination Certificate

active

06977818

ABSTRACT:
An electronic assembly comprises a support board, an integrated circuit chip interconnected and coupled to the support board, and a thermal-gap-filler pad placed over the integrated circuit chip and in contact with an external device to dissipate heat generated by the integrated circuit chip. The electronic assembly further comprises a standoff structure disposed adjacent the thermal-gap-filler pad and coupled to the support board, the standoff structure configured to prevent excessive force from being applied onto the thermal-gap-filler.

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