Heat dissipating device for an electronic device package

Details Heat dissipating device for an electronic device package Heat dissipating device for an electronic device package

1997-04-25

1999-03-23

Tolin, Gerald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

24563, 257727, 361704, H05K 720

Patent

active

058868739

ABSTRACT:
A device for dissipating heat generated from an electronic device package located above an upper face of a printed circuit board. This device can be a heat sink having a base in contact with an upper face of the electronic device package, and at least one fin formed on the base to dissipate the heat from said electronic device package. This device also has a pair of clips for clamping the base of the heat sink to the electronic device package to maintain a close thermal contact between the heat sink and the electronic device package.

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patent: 5367433 (1994-11-01), Blomquist
patent: 5371652 (1994-12-01), Clemens et al.
patent: 5436798 (1995-07-01), Wieland, Jr.
patent: 5521439 (1996-05-01), Casati
patent: 5586005 (1996-12-01), Cipolla
patent: 5594624 (1997-01-01), Clemens
patent: 5699229 (1997-12-01), Brownell

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