Heat-dissipating device for an electronic component

Details Heat-dissipating device for an electronic component Heat-dissipating device for an electronic component

1999-10-01

2000-10-24

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361687, 361695, 165 86, 165185, 174 163, 257719, H05K 720

Patent

active

061376833

ABSTRACT:
A heat-dissipating device is adapted for dissipating heat generated by a heat-producing electronic component inside an equipment housing. The heat-dissipating device includes a heat transfer plate, a heat exchanger pipe and a heat sink. The heat transfer plate is adapted to be mounted detachably on a heat-releasing side of the electronic component. The heat exchanger pipe has a heat exchanging coolant contained therein, a rear end portion connected to the heat transfer plate, and a front end portion. The heat sink has a first end and a second end opposite to the first end. The second end is coupled non-rotatably to the front end portion of the heat exchanger pipe. The assembly of the heat sink and the heat exchanger pipe is supported inside the housing such that the assembly of the heat sink and the heat exchanger pipe is rotatable relative to the housing about a pivot axis that extends between the first and second ends of the heat sink to permit movement of the heat transfer plate toward or away from the electronic component when the heat transfer plate is detached from the electronic component.

REFERENCES:
patent: 5588483 (1996-12-01), Ishida
patent: 5781409 (1998-07-01), Mecredy
patent: 5796581 (1998-08-01), Mok
patent: 5822187 (1998-10-01), Garner et al.
patent: 5835348 (1998-11-01), Ishida
patent: 5975195 (1999-11-01), Lowry et al.

Affiliated with

Also associated with

Rating

Heat-dissipating device for an electronic component does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat-dissipating device for an electronic component, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat-dissipating device for an electronic component will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1971172