Heat dissipating device for a semiconductor package

Details Heat dissipating device for a semiconductor package Heat dissipating device for a semiconductor package

1992-08-21

1995-03-07

Burke, Wallace R.

Equipment for production, distribution, or transformation of ene

Distribution, modification or control

Heat sink

Patent

active

D03560678

REFERENCES:
patent: D276719 (1984-12-01), Sugimoto et al.
patent: 3241605 (1966-03-01), Tabor
patent: 3406753 (1968-10-01), Habdas
patent: 3572428 (1971-03-01), Monaco
patent: 3589046 (1971-05-01), Jordan
patent: 3884293 (1975-05-01), Pessolano et al.
patent: 4292647 (1981-09-01), Lee
patent: 4644385 (1987-02-01), Nakanishi et al.
patent: 4716494 (1987-12-01), Bright et al.
patent: 5087888 (1992-02-01), Mountz et al.
patent: 5155579 (1992-10-01), Au Yeung
Air-cooled module on p. 1007 of IBM Technical Disclosure Bulletin vol. 20, No. 3 Aug. 1977.
Heat removal module on p. 2249 of IBM Technical Disclosure Bulletin vol. 22 No. 6 Nov. 1979.

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