Heat dissipating device for a memory chip

Details Heat dissipating device for a memory chip Heat dissipating device for a memory chip

2007-10-23

2007-10-23

Lea-Edmonds, Lisa (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S688000, C361S689000

Reexamination Certificate

active

11269050

ABSTRACT:
A heat dissipating device for a memory chip comprises a heat dissipating body; a middle section of each of two opposite sides of the heat dissipating body having a hook; a distal end of each hook being bent as a hooking end; wherein the hook can be hooked to the penetrating holes of a circuit board by the hooking ends to buckle the penetrating holes so as to fix a memory chip to the circuit board. Each of the four corners of the heat dissipating body is extended with a protrusion which is bent from the heat dissipating body to have the same orientation as the hook. The heat dissipating body has a recess at a center portion thereof. An outer side of the bending section is chamfered as a guiding angle. The hooking end may be a flat sheet, a cambered sheet or a U shape sheets.

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patent: 2004/0252461 (2004-12-01), Wu

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