Heat dissipating device assembly

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S704000, C257S718000, C174S016300, C165S080300

Reexamination Certificate

active

07142430

ABSTRACT:
A heat dissipating device assembly for an electronic components (70), includes a heat sink (10) for contacting the electronic component, and a locking device (20) and a back plate unit (40) for cooperatively mounting the heat sink to the electronic component. The locking device includes a retention module (28) located around the electronic component for supporting the heat sink thereon, and a clip (30) pivotably attached to the retention module. The clip includes a pressing portion and a pushing portion. The clip is pivotable between a first position in which the clip presses the heat sink toward the electronic component and a second position in which the clip pushes the heat sink in a direction away from the electronic component.

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patent: 6822869 (2004-11-01), Huang et al.
patent: 6867975 (2005-03-01), Kashiwagi
patent: 7019979 (2006-03-01), Wang et al.

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