Heat exchange – With retainer for removable article – Electrical component
Reexamination Certificate
1999-06-25
2001-05-15
Lazarus, Ira S. (Department: 3743)
Heat exchange
With retainer for removable article
Electrical component
C165S185000, C257S706000, C257S722000, C174S016300, C361S703000, C361S697000, C361S709000, C029S890030
Reexamination Certificate
active
06230789
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of The Invention
The present invention is related to a heat dissipating device, and particularly to a heat dissipating device for a computer, wherein the device includes a folded fin fixed to a base plate.
As the operation speed of a central processing unit (CPU) of a computer becomes faster and faster, heat generated by the operating CPU needs to be timely dissipated; otherwise, a malfunction or a unstableness of the CPU will happen. To solve this problem, a heat dissipating device is proposed to be attached to a top of the CPU thereby absorbing the heat generated by the CPU and transmitting it to a surrounding environment.
Presently, there are two types of heat dissipating device; the first type is made by aluminum extrusion to get a blank; the blank is then subject to a sawing process to get a number of pin fins on the heat dissipating device. Such a heat dissipating device has disadvantages that it is heavy, needs a complicated machining process and generates a bulk of wasted material.
The second type is made by first folding an aluminum sheet to get a folded fin; the folded fin is attached to a base plate by epoxy. Such a heat dissipating device has a disadvantage that since the epoxy needs a relatively long time to cure, the device needs a corresponding long period to be manufactured, which is not economical. Secondly, epoxy is expensive, which causes the cost of the heat dissipating device to be correspondingly high. Finally, epoxy will deteriorate after a period of use. When this happens, the bonding strength achieved by the epoxy is lowered.
Hence, an improved heat dissipating device is needed to eliminate the above mentioned defects of current heat dissipating devices.
SUMMARY OF THE INVENTION
A first objective of the present invention is to provide a low-cost and light heat dissipating device, wherein during the manufacturing of the heat dissipating device, almost no wasted material will be generated.
A second objective of the present invention is to provide a heat dissipating device which has a folded fin that can be quickly and securely fixed to a base plate.
A further objective of the present invention is to provide a method for manufacturing a heat dissipating device having the above advantages.
To fulfill the above mentioned objectives, according to one embodiment of the present invention, a heat dissipating device includes a flat base plate integrally formed with a number of studs thereon. A folded fin is attached to the base plate. The folded fin has a number of inverted U-shaped heat dissipating fins connecting with each other by a number of horizontal partitions. Each partition defines a number of holes fittingly received corresponding studs. A top end of each stud is pressed to fixedly connect the base plate and the partitions together whereby the folded fin and the base plate are fixedly connected with each other. Thermal grease fills-gaps between the partitions and the base plate, whereby heat absorbed by the base plate from a CPU can be effectively transmitted to the folded fin and finally to a surrounding environment through the folded fin.
The present invention also provides a method for manufacturing a heat dissipating device, the method comprising the following steps:
forming a corrugated folded fin having a number of inverted U-shaped heat dissipating fins connecting with each other by horizontal bottom partitions;
forming a number of holes in each of the partitions;
spreading thermal grease on a bottom face of each of the partitions;
forming a flat base plate with a number of studs thereon;
mounting the folded fin to the base plate to a position where the studs extend through the holes in the partitions; and
pressing the studs to cause the partitions and the base plate to fixedly connect together, wherein the thermal grease fills air gaps between the base plate and the partitions so that the folded fin is tightly connected with the base plate.
REFERENCES:
patent: 4546405 (1985-10-01), Hultmark et al.
patent: 5168926 (1992-12-01), Watson et al.
patent: 5381859 (1995-01-01), Minakami et al.
patent: 5710733 (1998-01-01), Chengson et al.
patent: 5838064 (1998-11-01), Shimada et al.
patent: 5870285 (1999-02-01), Kosteva et al.
patent: 5880930 (1999-03-01), Wheaton
patent: 5894882 (1999-04-01), Kikuchi et al.
patent: 5897917 (1999-04-01), Hinshaw et al.
patent: 5969949 (1999-10-01), Kim et al.
patent: 5969950 (1999-10-01), Tantoush
Chen Stanley
Lee Ken
Pei Hsien-Sheng
Su Eric
Chung Wei Te
Foxconn Precision Componment Co., LTD
Lazarus Ira S.
McKinnon Terrell
LandOfFree
Heat dissipating device and method making the same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat dissipating device and method making the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipating device and method making the same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2564927