Heat dissipating device and method for manufacturing it

Details Heat dissipating device and method for manufacturing it Heat dissipating device and method for manufacturing it

2006-11-28

2006-11-28

Datskovskiy, Michael (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S703000, C361S710000, C248S510000, C165S080300, C257S717000, C257S727000

Reexamination Certificate

active

07142426

ABSTRACT:
A heat dissipating device includes a heat sink forming a pressing portion thereon and a clip. The heat sink includes a hollow dissipating member and a column-shaped core, and the clip includes an integrally formed body defining a round hole therein. The pressing portion extends beyond the clip and presses the body of the clip on the heat sink. The method for manufacturing the heat dissipating device as above-mentioned includes the following steps: providing a heat sink with a collar formed thereon; providing a clip on the heat sink with the collar extending beyond the clip; having the collar deformed under pressure to form a pressing portion pressing the clip on the heat sink.

REFERENCES:
patent: 6381836 (2002-05-01), Lauruhn et al.
patent: 6386274 (2002-05-01), Wang et al.
patent: 6552902 (2003-04-01), Cho et al.
patent: 6947283 (2005-09-01), Hsieh et al.
patent: 2490699 (2002-05-01), None
patent: 2490703 (2002-05-01), None

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