Heat-dissipating device and its manufacturing process

Metal founding – Process – Shaping liquid metal against a forming surface

Reexamination Certificate

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C164S137000, C164S339000

Reexamination Certificate

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07401638

ABSTRACT:
A heat-dissipating device and its manufacturing process are provided for significantly increasing the number and size of blades so as to enhance the heat-dissipating performance. The heat-dissipating device has a plurality of blades arranged around the hub of the heat-dissipating device and there is an overlapped region formed between every two adjacent blades. A single mold is used to manufacture such a heat-dissipating device so that not only can the manufacturing cost be reduced but it can significantly increase the number and size of blades so as to increase the heat-dissipating efficiency.

REFERENCES:
patent: 3595301 (1971-07-01), Bauer
patent: 4462757 (1984-07-01), Uemura
patent: 5290149 (1994-03-01), Vieth et al.
patent: 5611668 (1997-03-01), Yapp et al.
patent: 6318964 (2001-11-01), Yang
patent: 6386276 (2002-05-01), Chen et al.
patent: 6463991 (2002-10-01), Reelfs et al.
patent: 6463992 (2002-10-01), Dowhan et al.
patent: 6511300 (2003-01-01), Otsuka et al.
patent: 6546993 (2003-04-01), Tilch
patent: 6572336 (2003-06-01), Horng et al.
patent: 6588485 (2003-07-01), Decker
patent: 6623265 (2003-09-01), Day
patent: 6779992 (2004-08-01), Lei et al.
patent: 6877958 (2005-04-01), Lin et al.
patent: 63-171242 (1988-07-01), None

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