Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2011-03-15
2011-03-15
Gandhi, Jayprakash N (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C361S719000, C361S720000, C165S104330, C257S715000
Reexamination Certificate
active
07907407
ABSTRACT:
A heat dissipating device is designed with calm, efficient, and space economy performance includes a housing (1) having an exhaust (10), and an intake (32). A fan (4) disposed inside the housing (1) is relative to the intake (32). A set of fins (10) disposed inside the housing (1) is relative to the exhaust (10). Said fan (4) is rotated to circulate cooling air into the set of fins (6), and expel hot air absorbed by the fins out of the exhaust. A first heat pipe (5) is disposed on an inner wall of the housing (1) relative to the fan (4). The first heat pipe (5) has a condensing portion at one end encircles most of the fan; an evaporating portion at the other end extends to the inner wall of the housing, where a heat-generating electronic component is located, is thermally connected to the set of fins (6).
REFERENCES:
patent: 6487076 (2002-11-01), Wang
patent: 6871702 (2005-03-01), Horng et al.
patent: 7343962 (2008-03-01), Xia et al.
patent: 7365989 (2008-04-01), Peng et al.
patent: 7414850 (2008-08-01), Hung
patent: 7551442 (2009-06-01), Stefanoski
patent: 2007/0131383 (2007-06-01), Hattori et al.
patent: 2007/0211432 (2007-09-01), Peng et al.
patent: 2008/0158820 (2008-07-01), Peng et al.
Chidae Electronics Co., Ltd.
Gandhi Jayprakash N
Smith Courtney
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