Heat dissipating device

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S697000, C174S015200, C174S016100, C174S016300, C257S713000, C257S715000, C257S722000, C165S080400, C165S080500, C165S104330, C062S003200

Reexamination Certificate

active

07852630

ABSTRACT:
A heat dissipation device includes a base, a first heat pipe, a first heat sink, a second heat pipe, a thermoelectric cooler and a second heat sink. The first heat pipe includes a first end and a second end. The first end of the first heat pipe is connected to the base. The second end of the first heat pipe is connected to a bottom of the first heat sink. The second heat pipe includes a first end and a second end. The first end of the second heat pipe is connected to the base. The second end of the second heat pipe is connected to a top end of the thermoelectric cooler. The second heat sink is mounted on a bottom of the thermoelectric cooler and located at a side of the first heat sink. The thermoelectric cooler spaces apart from the heat generating member. As such, the water generated by the thermoelectric cooler during a cooling process won't spread to the heat generating member and a short circuit of the heat generating member can be avoided.

REFERENCES:
patent: 6181556 (2001-01-01), Allman
patent: 2005/0174737 (2005-08-01), Meir
patent: 2006/0164808 (2006-07-01), Stefanoski
patent: 2009/0279251 (2009-11-01), Liu et al.

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