Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-08-14
2010-12-14
Pape, Zachary M (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S697000, C174S015200, C174S016100, C174S016300, C257S713000, C257S715000, C257S722000, C165S080400, C165S080500, C165S104330, C062S003200
Reexamination Certificate
active
07852630
ABSTRACT:
A heat dissipation device includes a base, a first heat pipe, a first heat sink, a second heat pipe, a thermoelectric cooler and a second heat sink. The first heat pipe includes a first end and a second end. The first end of the first heat pipe is connected to the base. The second end of the first heat pipe is connected to a bottom of the first heat sink. The second heat pipe includes a first end and a second end. The first end of the second heat pipe is connected to the base. The second end of the second heat pipe is connected to a top end of the thermoelectric cooler. The second heat sink is mounted on a bottom of the thermoelectric cooler and located at a side of the first heat sink. The thermoelectric cooler spaces apart from the heat generating member. As such, the water generated by the thermoelectric cooler during a cooling process won't spread to the heat generating member and a short circuit of the heat generating member can be avoided.
REFERENCES:
patent: 6181556 (2001-01-01), Allman
patent: 2005/0174737 (2005-08-01), Meir
patent: 2006/0164808 (2006-07-01), Stefanoski
patent: 2009/0279251 (2009-11-01), Liu et al.
Cooler Master Co. Ltd.
HDLS IPR Services
Pape Zachary M
Shih Chun-Ming
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