Heat dissipating device

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C165S104330, C165S185000, C257S719000, C361S719000

Reexamination Certificate

active

07606031

ABSTRACT:
A heat dissipating device includes a circuit board (23), an electronic component (24) being arranged on the circuit board, a base (211) being thermally attached to the electronic component, and a plurality of fasteners (22). The circuit board defines a plurality of screw holes (230) therein. The base defines a plurality of through holes (213) corresponding to the screw holes of the circuit board. Each fastener includes a bolt (27) extending through a corresponding through hole of the base and then threadly engaging into a corresponding screw hole of the circuit board, and a coil spring (28) mounted around the bolt. The base forms a plurality of latch hooks (214) near each through hole. A bottom ring (222) of the coil spring is sandwiched between the latch hooks and the base.

REFERENCES:
patent: 6317328 (2001-11-01), Su
patent: 6775030 (2004-08-01), Krabbenhoft et al.
patent: 6786691 (2004-09-01), Alden, III
patent: 6859367 (2005-02-01), Davison
patent: 6859368 (2005-02-01), Yang
patent: 7142422 (2006-11-01), Lee et al.
patent: 7283368 (2007-10-01), Wung et al.
patent: 7333340 (2008-02-01), Zhang et al.
patent: 7430122 (2008-09-01), Li
patent: 7462934 (2008-12-01), Reents
patent: 2005/0072558 (2005-04-01), Whitney et al.
patent: 2005/0225944 (2005-10-01), Leu
patent: 2006/0232944 (2006-10-01), Zhang et al.
patent: 2007/0217159 (2007-09-01), Long et al.

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