Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-12-27
2009-10-20
Thompson, Gregory D (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C165S104330, C165S185000, C257S719000, C361S719000
Reexamination Certificate
active
07606031
ABSTRACT:
A heat dissipating device includes a circuit board (23), an electronic component (24) being arranged on the circuit board, a base (211) being thermally attached to the electronic component, and a plurality of fasteners (22). The circuit board defines a plurality of screw holes (230) therein. The base defines a plurality of through holes (213) corresponding to the screw holes of the circuit board. Each fastener includes a bolt (27) extending through a corresponding through hole of the base and then threadly engaging into a corresponding screw hole of the circuit board, and a coil spring (28) mounted around the bolt. The base forms a plurality of latch hooks (214) near each through hole. A bottom ring (222) of the coil spring is sandwiched between the latch hooks and the base.
REFERENCES:
patent: 6317328 (2001-11-01), Su
patent: 6775030 (2004-08-01), Krabbenhoft et al.
patent: 6786691 (2004-09-01), Alden, III
patent: 6859367 (2005-02-01), Davison
patent: 6859368 (2005-02-01), Yang
patent: 7142422 (2006-11-01), Lee et al.
patent: 7283368 (2007-10-01), Wung et al.
patent: 7333340 (2008-02-01), Zhang et al.
patent: 7430122 (2008-09-01), Li
patent: 7462934 (2008-12-01), Reents
patent: 2005/0072558 (2005-04-01), Whitney et al.
patent: 2005/0225944 (2005-10-01), Leu
patent: 2006/0232944 (2006-10-01), Zhang et al.
patent: 2007/0217159 (2007-09-01), Long et al.
Hsieh Yi-Shih
Qiao Peng
Foxconn Technology Co., Ltd.
Fu Zhun Precision Industry (Shen Zhen) Co. Ltd.
Niranjan Frank R.
Thompson Gregory D
LandOfFree
Heat dissipating device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat dissipating device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipating device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4132874