Heat dissipating device

Heat exchange – With retainer for removable article – Electrical component

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C165S109100

Reexamination Certificate

active

07578337

ABSTRACT:
A heat dissipation device with a fluid cavity that utilizes a hybrid of star pins with concave surfaces and sharp edges, and truncated dimples, which creates turbulence and a vortex phenomenon perpendicular to fluid flow transmission, and increases the heat transfer coefficient without increasing restriction of fluid flow through the device. This process increases the heat transfer along local pins which are located around each truncated dimple. This effect allows the use of taller pins than previous devices thus increasing the surface of heat transfer and thus these pins have a more efficient heat transfer coefficient along the total length of the pin, not possible previously. Star pins with sharp edges prevent the distortion of the highly efficient vortex flow which increases fluid flow and simultaneously intensifies the desired phenomena of extraordinary turbulence.

REFERENCES:
patent: 3524497 (1970-08-01), Chu et al.
patent: 4188996 (1980-02-01), Pellant et al.
patent: 5021924 (1991-06-01), Kieda
patent: 5170319 (1992-12-01), Chu
patent: 5183104 (1993-02-01), Novotny
patent: 5213153 (1993-05-01), Itoh
patent: 5220804 (1993-06-01), Tilton
patent: 5239443 (1993-08-01), Fahey et al.
patent: 5269146 (1993-12-01), Kerner
patent: 5412536 (1995-05-01), Anderson
patent: 5781411 (1998-07-01), Feenstra
patent: 5831824 (1998-11-01), McDunn
patent: 5988266 (1999-11-01), Smith et al.
patent: 6039114 (2000-03-01), Becker et al.
patent: 6141214 (2000-10-01), Ahn
patent: 6173758 (2001-01-01), Ward et al.
patent: 6343012 (2002-01-01), Rife
patent: 6366462 (2002-04-01), Chu
patent: 6401807 (2002-06-01), Wyler
patent: 6469898 (2002-10-01), Rouchon
patent: 6650538 (2003-11-01), Chu
patent: 6666260 (2003-12-01), Tantoush
patent: 6671172 (2003-12-01), Carter
patent: 6729383 (2004-05-01), Cannell et al.
patent: 6807059 (2004-10-01), Dale
patent: 6817405 (2004-11-01), Kamath
patent: 6820684 (2004-11-01), Chu
patent: 6914782 (2005-07-01), Ku
patent: 6940718 (2005-09-01), Gedamu
patent: 6973801 (2005-12-01), Campbell
patent: 6988534 (2006-01-01), Kenny
patent: 7000684 (2006-02-01), Kenny
patent: 7035104 (2006-04-01), Meyer
patent: 7174738 (2007-02-01), Scott
patent: 2003/0011987 (2003-01-01), Chu
patent: 2003/0183368 (2003-10-01), Paradis et al.
patent: 2003/0226371 (2003-12-01), Rini
patent: 2004/0108101 (2004-06-01), Dugas
patent: 2004/0150956 (2004-08-01), Conte
patent: 2005/0047105 (2005-03-01), Gedamu
patent: 2006/0042825 (2006-03-01), Lu
patent: 2006/0126296 (2006-06-01), Campbell
Ekkad et al., Dimple Enhanced Heat Transfer in High Aspect Ratio Channels, J. Enhanced Heat Trans., 2003, pp. 395-405, vol. 10(4).
Isaev et al., Numerical Analysis of the Jet-Vortex Pattern of Flow in a Rectangular Trench, J. Eng. Phys. & Thermophys., 2003, pp. 61-69, vol. 76(1).
Patrick, W.V., Computations of Flow Structures and Heat Transfer in a Dimpled Channel at Low to Moderate Reynolds Number, Apr. 25, 2005, Master's Thesis, Virginia Polytechnic Institute and State University.
Syred et al., Effect of Surface Curvature on Heat Transfer and Hydrodynamics Within a Single Hemispherical Dimple, J. Turbomachinery, Jul. 2001, pp. 609-613, vol. 123.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Heat dissipating device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat dissipating device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipating device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4057392

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.