Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-12-17
2009-12-22
Thompson, Gregory D (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C165S080200, C165S185000, C257S707000, C257S712000, C257S718000, C257S719000, C361S707000
Reexamination Certificate
active
07636241
ABSTRACT:
A heat dissipating device includes a heat sink, and a block. The heat sink includes a base and a plurality of fins formed on the base. A bottom portion of the base defines a first groove. The block defines a second groove in one surface of the block. The block is received in the first groove, and an electronic component is received in the second groove.
REFERENCES:
patent: 4546409 (1985-10-01), Yoshino et al.
patent: 6188579 (2001-02-01), Buondelmonte et al.
patent: 6245442 (2001-06-01), Towata et al.
patent: 6285552 (2001-09-01), Adachi
patent: 6702007 (2004-03-01), Pan et al.
patent: 2007/0062676 (2007-03-01), Yao
Gan Xiao-Lin
Ho Yu-Kuang
Liu Chang-Chun
Hon Hai Precision Industry Co. Ltd.
Hong Fu Jin Precision Industry ( ShenZhen) Co., Ltd.
Niranjan Frank R.
Thompson Gregory D
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