Heat dissipating device

Details Heat dissipating device Heat dissipating device

2007-12-18

2007-12-18

Vortman, Anatoly (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S709000, C361S710000, C257S718000, C257S719000

Reexamination Certificate

active

11065387

ABSTRACT:
A heat dissipating device of the present invention includes a heat sink (20) and two locking devices (10) for securing the heat sink. The heat sink includes a base (22) for contacting an electronic component. Each locking device includes a spring member, a post (12) and a sleeve (18). The spring member elastically rests on the base. The post extends through the sleeve. The post has one end engaging with the spring member, and an opposite end thereof extending beyond the sleeve for locking the combination. The sleeve has one end tightly grasping the post, and an opposite end thereof preventing the locking device from departing from the heat sink.

REFERENCES:
patent: 5603374 (1997-02-01), Wu
patent: 5757621 (1998-05-01), Patel
patent: 5901039 (1999-05-01), Dehaine et al.
patent: 5969950 (1999-10-01), Tantoush
patent: 6157539 (2000-12-01), Wagner et al.
patent: 6304452 (2001-10-01), Lo
patent: 6307748 (2001-10-01), Lin et al.
patent: 6317328 (2001-11-01), Su
patent: 6374906 (2002-04-01), Peterson et al.
patent: 6392889 (2002-05-01), Lee et al.
patent: 6412546 (2002-07-01), Lin et al.
patent: 6480387 (2002-11-01), Lee et al.
patent: 6585534 (2003-07-01), Llapitan et al.
patent: 6606254 (2003-08-01), Yoneda
patent: 6667885 (2003-12-01), Malone et al.
patent: 6697256 (2004-02-01), Horng et al.
patent: 6752577 (2004-06-01), Chen et al.
patent: 6826054 (2004-11-01), Liu
patent: 6920052 (2005-07-01), Callahan et al.
patent: 7019979 (2006-03-01), Wang et al.
patent: 7164583 (2007-01-01), Lee et al.
patent: 2002/0067599 (2002-06-01), Mann
patent: 01269676.5 (2002-10-01), None
patent: 02200386.X (2002-11-01), None
patent: 406824 (2000-09-01), None
patent: 578981 (2004-03-01), None

Affiliated with

Also associated with

Rating

Heat dissipating device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat dissipating device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipating device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3870856