Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-03-20
2007-03-20
Datskovsky, Nichael (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C165S080300
Reexamination Certificate
active
10900864
ABSTRACT:
A heat dissipating device is adapted to remove heat from an electronic package. The heat dissipating device includes a fan (1) for generating airflow and a heat sink (2). The heat sink has a base (21) and a plurality of fins (22). A chamber (25) is defined with the fins surrounding for receiving the fan. At least one channel (23) is defined in the base for allowing airflow directly blowing on the electronic package under the heat sink.
REFERENCES:
patent: 5384940 (1995-01-01), Soule et al.
patent: 5519575 (1996-05-01), Chiou
patent: 5584339 (1996-12-01), Hong
patent: 5661638 (1997-08-01), Mira
patent: 5740014 (1998-04-01), Lin
patent: 5794685 (1998-08-01), Dean
patent: 6023413 (2000-02-01), Umezawa
patent: 6367542 (2002-04-01), Chen
patent: 6666640 (2003-12-01), Hsieh
patent: 6691769 (2004-02-01), Johnson et al.
Hwang Ching-Bai
Xu Li-Fu
Yang Chih-Hao
Chung Wei Te
Datskovsky Nichael
Foxconn Technology Co., Ltd.
Fu Zhun Precision Ind. (Shenzhen) Co., Ltd.
Hoffberg Robert J.
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