Heat dissipating device

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C361S704000, C165S080300

Reexamination Certificate

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10900864

ABSTRACT:
A heat dissipating device is adapted to remove heat from an electronic package. The heat dissipating device includes a fan (1) for generating airflow and a heat sink (2). The heat sink has a base (21) and a plurality of fins (22). A chamber (25) is defined with the fins surrounding for receiving the fan. At least one channel (23) is defined in the base for allowing airflow directly blowing on the electronic package under the heat sink.

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patent: 5519575 (1996-05-01), Chiou
patent: 5584339 (1996-12-01), Hong
patent: 5661638 (1997-08-01), Mira
patent: 5740014 (1998-04-01), Lin
patent: 5794685 (1998-08-01), Dean
patent: 6023413 (2000-02-01), Umezawa
patent: 6367542 (2002-04-01), Chen
patent: 6666640 (2003-12-01), Hsieh
patent: 6691769 (2004-02-01), Johnson et al.

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