Heat dissipating device

Details Heat dissipating device Heat dissipating device

1998-03-09

1999-11-02

Tolin, Gerald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 803, 361703, H05K 720

Patent

active

059782196

ABSTRACT:
A heat dissipating device for CPU generally comprises a bracket, a cooling fan, a specially designed air hose that connects the inlet of the cooling fan and the inlet of the computer housing, and an upper lid. The specially designed air hose is connected to the inlet of the cooling fan. The other end of the hose is arranged such that it may draw the fresh air into the computer housing. The bracket is preferably made from aluminum and can be properly mounted onto the top surface of the CPU. When the cooling fan operates, the cooling air can be readily sucked and directed to the mounting recess of the bracket. The heat built-up resulted from the operation of CPU can be readily dissipated by those introduced airflow. When the airflow passes through the heat dissipating fins, the heat from the CPU can be effectively dissipated.

REFERENCES:
patent: 5285347 (1994-02-01), Fox
patent: 5422787 (1995-06-01), Gourdine
patent: 5428503 (1995-06-01), Matsushima
patent: 5535094 (1996-07-01), Nelson
patent: 5559674 (1996-09-01), Katsui
patent: 5816319 (1998-10-01), Kamekawa

Affiliated with

Also associated with

Rating

Heat dissipating device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat dissipating device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipating device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2144079