Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material
Reexamination Certificate
2006-02-21
2006-02-21
Mckinnon, Terrell (Department: 3753)
Heat exchange
Intermediate fluent heat exchange material receiving and...
Liquid fluent heat exchange material
C165S104210, C165S080400, C361S700000, C361S704000, C257S715000, C174S015200
Reexamination Certificate
active
07000687
ABSTRACT:
A heat dissipating device (1) for removing heat from electronic devices is disclosed. The heat dissipating device includes a heat sink (30) and at least one heat pipe (20). The heat sink includes a Y-shaped heat conductive body and a plurality of fins (35) extending from the body. The body includes a solid block (32) and two extension arms (34) extending aslant from a top of the block in opposite directions. An U-shaped groove (35) is defined in the block and extends to an upper portion (33) of the block. The heat pipe comprises an evaporating portion (22) and a condensing portion (24) extending upwardly from the evaporating portion. The heat pipe is received in the groove so that the heat pipe absorbs heat via the evaporating portion and transfers the heat to the upper portion of the block via the condensing portion thereof.
REFERENCES:
patent: 6102110 (2000-08-01), Julien et al.
patent: 6189601 (2001-02-01), Goodman et al.
patent: 6450250 (2002-09-01), Guerrero
patent: 6542364 (2003-04-01), Lai et al.
patent: 6651734 (2003-11-01), Liu
patent: 6779595 (2004-08-01), Chiang
patent: 6796373 (2004-09-01), Li
patent: 6808013 (2004-10-01), Lai et al.
patent: 6827136 (2004-12-01), Liu
patent: 6830098 (2004-12-01), Todd et al.
patent: 6915844 (2005-07-01), Chou
patent: 2003/0019610 (2003-01-01), Liu
patent: 2003/0141041 (2003-07-01), Chen
patent: 2004/0035558 (2004-02-01), Todd et al.
patent: 2004/0050534 (2004-03-01), Malone et al.
patent: 02287462.3 (2003-12-01), None
patent: 514488 (2002-12-01), None
patent: 532747 (2003-05-01), None
Huang Ai-Min
Lin Shu-Ho
Ying Guo-Liang
Hon Hai Precision Industry Co. Ltd.
Mckinnon Terrell
Morris Manning & Martin
Tingkang Xia, Esq. Tim
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