Heat dissipating device

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C165S080300, C165S104330, C165S121000, C361S700000

Reexamination Certificate

active

07130192

ABSTRACT:
A heat dissipating device is adapted to remove heat from an electronic package. The heat dissipating device includes a heat sink (10) and a fan (30) generating airflow. The heat sink has a base (11) and a plurality of first fins (13) extending therefrom. First airflow channels (132) are defined between the first fins. A plurality of second fins (15) are transversely attached to the first fins. The second fins have second airflow channels (152) defined therebetween. The second airflow channels communicate with the first airflow channels.

REFERENCES:
patent: 6779595 (2004-08-01), Chiang
patent: 2005/0073811 (2005-04-01), Wang et al.

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