Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-10-31
2006-10-31
Thompson, Gregory (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C165S080300, C165S104330, C165S121000, C361S700000
Reexamination Certificate
active
07130192
ABSTRACT:
A heat dissipating device is adapted to remove heat from an electronic package. The heat dissipating device includes a heat sink (10) and a fan (30) generating airflow. The heat sink has a base (11) and a plurality of first fins (13) extending therefrom. First airflow channels (132) are defined between the first fins. A plurality of second fins (15) are transversely attached to the first fins. The second fins have second airflow channels (152) defined therebetween. The second airflow channels communicate with the first airflow channels.
REFERENCES:
patent: 6779595 (2004-08-01), Chiang
patent: 2005/0073811 (2005-04-01), Wang et al.
Dong Shun Chi
Huang Aimin
Huang Chung-Yuan
Wang Yaxiong
Chung Wei Te
Foxconn Technology Co., Ltd.
Fu Zhun Precision Industry (Shenzhen) Co., Ltd.
Thompson Gregory
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