Heat dissipating device

Details Heat dissipating device Heat dissipating device

2002-12-31

2004-06-01

Datskovsky, Michael (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S695000, C361S697000, C165S080300, C454S184000

Reexamination Certificate

active

06744631

ABSTRACT:

CROSS-REFERENCE TO RELATED APPLICATION
This application claims priority of Taiwanese application No. 091218426, filed on Nov. 15, 2002.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates to a heat dissipating device, more particularly to a heat dissipating device of an electronic device.
2. Description of the Related Art
As technology advances in the field of portable computers, performance of the portable computer has become more and more powerful and processing speeds are also on the rise. Under such high speed operation, considerable heat is generated by electronic components, such as a central processing unit (CPU), of the portable computer. Thus, heat dissipation is a major concern of portable computer manufacturers.
As shown in
FIG. 1
, a conventional portable computer
1
includes a housing
11
and a heat dissipating device. The housing
11
includes a lateral wall
111
that is formed with vent holes
112
therethrough. The heat dissipating device includes a fan unit
12
that is mounted in the housing
11
for circulating air within the housing
11
, and that is operable so as to allow cool air to flow into and heated air to flow out of the housing
11
through the vent holes
112
in the lateral wall
111
. When the fan unit
12
operates, the heated air attributed to a CPU (not shown) and other electronic components (not shown) disposed in the housing
11
is expelled out of the housing
11
through the vent hole
112
in the lateral wall
111
. However, since the heated air is not expelled out of the housing
11
quite fast enough, part of the heated air remains in the housing
11
, thereby resulting in a poor heat-dissipating efficiency.
SUMMARY OF THE INVENTION
Therefore, the object of the present invention is to provide a heat dissipating device that can overcome the aforesaid drawback associated with the prior art.
According to the present invention, a heat dissipating device comprises a housing and a fan unit. The housing has a top wall, a bottom wall opposite to the top wall and a lateral wall that interconnects the top and bottom walls. Each of the top, bottom and lateral walls is formed with at least one vent hole therethrough. The fan unit is mounted in the housing for circulating air within the housing. The fan unit is operable so as to allow cool air to flow into and heated air to flow out of the housing through the vent holes in the top, bottom and lateral walls.


REFERENCES:
patent: 5694294 (1997-12-01), Ohashi et al.
patent: 6111748 (2000-08-01), Bhatia
patent: 6132170 (2000-10-01), Horng
patent: 6141214 (2000-10-01), Ahn
patent: 6348748 (2002-02-01), Yamamoto
patent: 2003/0161102 (2003-08-01), Lee et al.
patent: 2003/0223864 (2003-12-01), Horng et al.

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