Heat dissipating device

Heat exchange – With retainer for removable article – Electrical component

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C165S185000, C361S704000, C257S719000

Reexamination Certificate

active

06446708

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates to a heat dissipating device, more particularly to a heat dissipating device that can improve heat-dissipating efficiency.
2. Description of the Related Art
With the increase in the functions of the microprocessor, the microprocessor is likely to generate large amounts of heat during operation thereof. To prevent overheating which may result in undesirable shutdown of the microprocessor, a heat sink is generally disposed on the microprocessor to help dissipate the heat generated thereby. A fan can also be disposed on the heat sink for cooling the same.
FIG. 1
illustrates a conventional heat dissipating device that includes a base plate
10
, and rows of parallel heat-dissipating posts
11
mounted on the base plate
10
. Generally, the number of the posts
11
is limited by the size of the base plate
10
. Further, referring to
FIG. 2
, any two adjacent rows of the posts
11
define an air path
12
, within which air is prevented by the base plate
10
from flowing therethrough in a direction perpendicular to the base plate
10
. When a fan (not shown) is disposed on the conventional heat dissipating device for blowing air toward the posts
11
, air convection around the posts
11
is reduced, thereby resulting in a poor heat-dissipating efficiency.
SUMMARY OF THE INVENTION
Therefore, the object of the present invention is to provide a heat dissipating device that can enhance air convection so as to improve the heat-dissipating efficiency.
According to the present invention, a heat dissipating device comprises:
a base unit having a top surface, and a bottom surface adapted to contact and to be in thermal communication with a heat-generating source; and
a plurality of parallel heat-dissipating fin units provided on the top surface of the base unit, each of the fin units being spaced apart from each other along a first direction, and including
a mounting portion having a lower end connected integrally to the top surface of the base unit, an upper end, and two opposite sides,
two extensions extending respectively and integrally from the sides of the mounting portion along a second direction transverse to the first direction, each of the extensions having upper and lower ends, and
a plurality of elongated parallel fin plates extending from the upper end of the mounting portion and from the upper and lower ends of the extensions along a third direction that is perpendicular to the bottom surface of the base unit, and the first and second directions.


REFERENCES:
patent: 3303392 (1967-02-01), Zelina
patent: 3541433 (1970-11-01), Davis
patent: 3566958 (1971-03-01), Zelina
patent: 4557225 (1985-12-01), Sagues et al.
patent: 5486980 (1996-01-01), Jordan et al.
patent: 5574626 (1996-11-01), Smith
patent: 5927386 (1999-07-01), Lin
patent: 6138488 (2000-10-01), Lee

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Heat dissipating device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat dissipating device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipating device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2833258

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.