Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-01-09
1998-10-06
Tolin, Gerald P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
16510433, 174 152, 361687, H05K 720
Patent
active
058186930
ABSTRACT:
The apparatus is a cooling structure for laptop computers, in which the heat is transferred to a heat pipe in the cover of the case behind the display screen. The heat pipe behind the screen is interconnected with the external wall of the cover by a holding fixture which, preferably, is integrated into the cover wall during manufacture. The cover is specially constructed with high thermal conductivity carbon fibers which are oriented to preferentially conduct heat from the heat pipe to the cover and to spread the heat over the entire external surface of the cover for dissipation into the environment.
REFERENCES:
patent: 4204246 (1980-05-01), Arii et al.
patent: 4449578 (1984-05-01), Munekawa
patent: 4471837 (1984-09-01), Larson
patent: 4781175 (1988-11-01), McGreevy et al.
patent: 4849858 (1989-07-01), Grapes et al.
patent: 4995451 (1991-02-01), Hamburgen
patent: 4998933 (1991-03-01), Eggers et al.
patent: 5077637 (1991-12-01), Martorana
patent: 5089002 (1992-02-01), Kirwan, Jr.
patent: 5095404 (1992-03-01), Chao
patent: 5178620 (1993-01-01), Eggers et al.
patent: 5287248 (1994-02-01), Montesano
patent: 5312401 (1994-05-01), Newton et al.
patent: 5339214 (1994-08-01), Nelson
patent: 5366443 (1994-11-01), Eggers et al.
patent: 5383340 (1995-01-01), Larson et al.
patent: 5390734 (1995-02-01), Voorhes
patent: 5404272 (1995-04-01), Lebailly et al.
patent: 5419767 (1995-05-01), Eggers et al.
patent: 5513070 (1996-04-01), Xie et al.
patent: 5708297 (1998-01-01), Clayton
Garner Scott D.
Toth Jerome E.
Fruitman Martin
Thermal Corp.
Tolin Gerald P.
LandOfFree
Heat dissipating computer case having oriented fibers and heat p does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat dissipating computer case having oriented fibers and heat p, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipating computer case having oriented fibers and heat p will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-85715