Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2001-07-30
2002-06-18
Thompson, Gregory (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C165S080300, C165S122000, C165S185000, C257S718000, C257S722000, C257S719000, C361S704000
Reexamination Certificate
active
06407920
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to a heat-dissipating assembly. The present invention also relates to a process for assembling the same.
BACKGROUND OF THE INVENTION
An integrated circuit chip is widely used in an electrical appliance such as a computer. When the electrical appliance operates, the chip generates energy in the form of heat. If the chip is unable to transfer enough heat to ambient air, the elevated operating temperature may result in damage of the chip or breakdown of the whole appliance. In order to remove most heat generated from the chip, especially a CPU (central processing unit), an additional heat sink is usually attached on and spreads over the top surface thereof. The heat sink is made of a highly thermal conductive material and has a larger surface area than the attached CPU for improving heat transfer. In addition, the heat sink is frequently constructed with spaced fins in order to provide extra surface area. Furthermore, heat can be quickly dissipated by improving the efficiency of the air circulation when a fan is disposed on the heat sink.
FIG. 1
is an exploded view showing a typical heat-dissipating assembly for a CPU
11
. The heat-dissipating assembly includes a heat sink
12
and a fan
13
. The heat sink
12
is made of a highly conductive material, for example aluminum. The heat sink
12
includes a base
120
and a plurality of sheet-shaped fins
121
. The base
120
is in contact with the top surface of the CPU chip
11
. The fan
13
is disposed on the heat sink
12
.
The heat sink
12
is mounted by edge plates
123
on two sides thereof. The edge plates
123
are bent to form sheltering plates
124
. The sheltering plates
124
have openings
125
corresponding to holes
131
of the fan
13
. The fan
13
is coupled with heat sink
12
by passing screws
16
through the holes
131
and then engaging the screws
16
with the openings
125
.
It is found that the process for coupling the heat sink
12
with the fan
13
has the following disadvantages:
(1) The procedures of mounting the edge plates
123
onto the heat sink
12
, bend the edge plates
123
to form sheltering plates
124
and drilling opening
125
are labor-intensive and time-consuming.
(2) Since four screws
16
and two edge plates
123
are required, the material cost is high.
(3) The screws
16
are engaged with the opening
125
one by one, which is also time-consuming.
Therefore, the present invention provides an improved heat-dissipating assembly and a process for assembling the same so as to overcome the problems described above.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide a heat-dissipating assembly for reducing assembling time.
It is another object of the present invention to provide a heat-dissipating assembly for reducing material cost.
In accordance with an aspect of the present invention, there is provided a heat-dissipating assembly for removing a portion of heat from a heat-generating device. The heat-dissipating assembly includes a fan and a heat sink. The fan has holes. The heat sink has a base in contact with a surface of the heat-generating device, and first fins and second fins extending upwards from the base, wherein the second fins further have projecting plates corresponding to the holes, each of the projecting plates includes a pedestal and a fastening portion, and the height of the pedestal is substantially the same as that of the fan, wherein the projecting plates are inserted into the corresponding holes and the fasting portions are bent so as to be in contact with the upper surface of the fan.
Preferably, the heat-generating device is an electronic device in operation.
Preferably, the electronic device is a CPU (central processing unit).
Preferably, the projecting plates are integrally formed with the second fins.
Preferably, two notches are formed between the pedestal and the fastening portion.
Preferably, the maximum cross-sectional length of the pedestal is slightly smaller than the diameter of the hole.
In accordance with another aspect of the present invention, there is provided a heat-dissipating assembly for removing a portion of heat from a CPU (central processing unit). The heat-dissipating assembly includes a fan having holes and a heat sink having a base in contact with a surface of the CPU and first fins and second fins extending upwards from the base, wherein the second fins further have projecting plates corresponding to the holes, each of the projecting plates includes a pedestal and a fastening portion, two notches are formed between the pedestal and the fastening portion, and the height of the pedestal is substantially the same as that of the fan, wherein the projecting plates are inserted into the corresponding holes and the fasting portions are bent so as to be in contact with the upper surface of the fan.
Preferably, the projecting plates are integrally formed with the second fins.
In accordance with another aspect of the present invention, there is provided a process for assembling a heat-dissipating assembly. The process includes steps of (a)providing a fan having holes and a heat sink, wherein the heat sink has first fins and second fins, the second fins have projecting plates corresponding to the holes and each of the projecting plates includes a pedestal and a fastening portion; (b)allowing the projecting plates to be inserted into the corresponding holes, thereby protruding the fastening portions through the holes; and (c)bending the fastening portions to be in contact with the upper surface of the fan.
Preferably, the projecting plates are integrally formed with the second fins.
Preferably, two notches are formed between the pedestal and the fastening portion.
The above objects and advantages of the present invention will become more readily apparent to those ordinarily skilled in the art after reviewing the following detailed description and accompanying drawings, in which:
REFERENCES:
patent: 5287249 (1994-02-01), Chen
patent: 5828551 (1998-10-01), Hoshino et al.
patent: 6269864 (2001-08-01), Kabadi
patent: 6343013 (2002-01-01), Chen
patent: 6352103 (2002-03-01), Chu et al.
Jui-Yuan Hsu
Yu Chen Yu Timothy
Delta Electronics , Inc.
Thompson Gregory
LandOfFree
Heat-dissipating assembly and process for assembling the same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat-dissipating assembly and process for assembling the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat-dissipating assembly and process for assembling the same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2978597