Heat dissipating assembly and electronic device having same

Details Heat dissipating assembly and electronic device having same Heat dissipating assembly and electronic device having same

2008-09-18

2010-06-01

Datskovskiy, Michael V (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S679460, C361S679470, C361S679480, C361S695000, C361S697000, C165S080300, C165S104270, C165S104330, C165S104340, C174S015100

Reexamination Certificate

active

07729123

ABSTRACT:
A heat dissipating assembly capable of being placed between a circuit board and a casing of an electronic device includes a fan assembly and a bracket. The fan assembly is mounted on the circuit board. The fan assembly includes an enclosure defining a chamber and an opening at a side wall thereof, along with a blower received in the chamber. The bracket is located between the fan assembly and the casing of the electronic device. The bracket has a side wall thereof defining a cutout connected with the chamber. The cutout and the opening of the enclosure are defined at two different sides of the heat dissipating assembly.

REFERENCES:
patent: 4885488 (1989-12-01), Cox
patent: 5676523 (1997-10-01), Lee
patent: 5701045 (1997-12-01), Yokozawa et al.
patent: 5879141 (1999-03-01), Yokozawa et al.
patent: 5940268 (1999-08-01), Miyahara et al.
patent: 6157104 (2000-12-01), Yokozawa et al.
patent: 6498724 (2002-12-01), Chien
patent: 7123484 (2006-10-01), Tsai
patent: 7237599 (2007-07-01), Lopatinsky et al.
patent: 7289320 (2007-10-01), Chang et al.
patent: 7307843 (2007-12-01), Harman et al.
patent: 2008/0030949 (2008-02-01), Hsiao
patent: 405304379 (1993-11-01), None

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