Heat dissipating assembly

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S704000, C361S697000, C361S709000, C361S710000, C165S080300, C165S185000

Reexamination Certificate

active

07929293

ABSTRACT:
A heat dissipating assembly includes a heat generating component, a heat sink, and a fan. The heat sink includes a base attached on the heat generating component and a plurality of fins attached on the base. The fan is attached to a top surface of the fins. The top surface of the fins is wider than the base. The fins incline inwardly from the top surface to the base for gathering cooling air from the fan to the base.

REFERENCES:
patent: 6308771 (2001-10-01), Tavassoli
patent: 6418020 (2002-07-01), Lin
patent: 6505680 (2003-01-01), Hegde
patent: 6657865 (2003-12-01), Tseng et al.
patent: 6675885 (2004-01-01), Kuo
patent: 6779593 (2004-08-01), Hegde
patent: 7164582 (2007-01-01), Hegde
patent: 7408777 (2008-08-01), Jeong
patent: 7753106 (2010-07-01), Lin et al.
patent: 2003/0209342 (2003-11-01), Hsin et al.
patent: 2006/0139887 (2006-06-01), Kameda
patent: 2007/0084595 (2007-04-01), Lin et al.
patent: 2010/0046168 (2010-02-01), Liaw
patent: 406021283 (1994-01-01), None

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