Heat dissipating assembly

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C165S080300, C165S185000, C257S719000

Reexamination Certificate

active

11163516

ABSTRACT:
A heat dissipating assembly includes a heat sink (10) having a chassis (12), a back plate (30) and a plurality of fasteners (40). Each fastener includes a screw cap (42), a spring (44) and a sleeve (46). The screw cap and the sleeve are movably connected together. The screw cap includes a head (420) and a tube (422) extending from the head. The tube includes a first cavity (424) and a second cavity (426). The back plate forms a plurality of posts (34) passing through the chassis and threadedly engaging in the first cavities of the tubes. A spring (44) is compressed between the first cavity of the tube and a bottom wall of the sleeve, for providing appropriate downwardly pressing force on the chassis of the heat sink against a CPU (22) mounted on a PCB (20).

REFERENCES:
patent: 5757621 (1998-05-01), Patel
patent: 6480387 (2002-11-01), Lee et al.
patent: 6497273 (2002-12-01), Horng et al.
patent: 6545879 (2003-04-01), Goodwin
patent: 6611431 (2003-08-01), Lee et al.
patent: 6697256 (2004-02-01), Horng et al.
patent: 6826054 (2004-11-01), Liu
patent: 7126823 (2006-10-01), Chen et al.
patent: 7142422 (2006-11-01), Lee et al.
patent: 7164583 (2007-01-01), Lee et al.
patent: 7180743 (2007-02-01), Chen et al.
patent: 2006/0245165 (2006-11-01), Lin

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