Heat dissipating arrangement in a portable computer

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Patent

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Details

361704, 361719, H05K 720

Patent

active

055575005

ABSTRACT:
A heat dissipating arrangement in a portable computer uses a copper slug disposed between a heat-generating central processing unit (CPU) chip and the underside of a metallic keyboard baseplate. The slug also extends through a copper-plated hole in a printed circuit (PC) board, and is either soldered to the copper plating or press-fit into the hole to enhance heat transfer between the slug and the PC board. Small through-holes extend through the PC board and the copper plating next to the opening. These through-holes connect the copper plating to several layers of etch within the PC board, so that these layers act like fins on a heat sink to increase heat transfer away from the CPU.

REFERENCES:
patent: 4535385 (1985-08-01), August
patent: 4729061 (1988-03-01), Brown
patent: 5138523 (1992-08-01), Benck
patent: 5313362 (1994-05-01), Hatada
patent: 5402311 (1995-03-01), Nakajima
patent: 5424913 (1995-06-01), Swindler

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