Heat dissipating apparatus for chips

Details Heat dissipating apparatus for chips Heat dissipating apparatus for chips

2009-08-12

2010-10-26

Chervinsky, Boris L (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S719000, C165S080300, C174S016300

Reexamination Certificate

active

07821789

ABSTRACT:
A heat dissipating apparatus includes a heat sink, a blower, and a fan. The blower and the fan can be mounted together via a connection element. The heat sink defines an accommodating space. The blower and the fan can be positioned to the heat sink via the connection element, with the blower being accommodated in the accommodating space. The heat dissipating apparatus can achieve an optimal heat dissipating effect.

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patent: 2003/0007867 (2003-01-01), Chang

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