Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2000-10-25
2001-11-27
Thompson, Gregory (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C062S003200, C062S003700, C062S259200, C136S203000, C136S204000, C165S080400, C165S185000, C257S714000, C361S704000, C361S719000
Reexamination Certificate
active
06324058
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates to a heat-dissipating apparatus for an integrated circuit device, more particularly to a heat-dissipating apparatus that is simple to manufacture and assemble and that prevents condensation of water droplets therein.
2. Description of the Related Art
Electronic devices, such as integrated circuit devices, generate heat during operation. The heat or rise in temperature will affect the dynamic characteristics of an electronic device and hence shorten the service life thereof. A heat-dissipating apparatus can help dissipate the heat of the electronic device to thereby prolong the service life and increase the operational speed thereof.
A conventional heat-dissipating apparatus is shown in FIG.
1
. As illustrated, the heat-dissipating apparatus includes a cooling fin member
1
and a fan
2
mounted on top of the cooling fin member
1
. During operation, the heat generated by an integrated circuit device is transferred to the cooling fin member
1
, and the fan
2
generates a current of air to dissipate the heat transferred to the cooling fin member
1
. However, as air is not a good heat conductor, the heat-dissipating effect of the fan
2
is not satisfactory. Besides, in order not to obstruct the discharge of hot air by the fan
2
, the fan
2
and hence the integrated circuit device cannot be disposed too close to a wall surface, thereby affecting the utility of the apparatus.
FIG. 2
shows another conventional heat-dissipating apparatus. As illustrated, a thermoelectric cooling unit
5
is disposed between an integrated circuit device
3
and a fan
4
. The fan
4
and the cooling unit
5
are secured on a circuit board
7
by using a mounting bracket
6
. The cooling unit
5
is a semiconductor device that includes an array of N-type semiconductor units
501
, P-type semiconductor units
502
, and metal conductors
503
interconnecting the N-type and P-type semiconductor units
501
,
502
. First and second ceramic sheets
504
,
505
are respectively disposed on upper and lower sides of the array. The first ceramic sheet
505
has a top side forming a heat-releasing side, while the second ceramic sheet
505
has a bottom side in contact with the integrated circuit device
3
and forming a heat-absorbing side. When an electric current is passed through the metal conductors
503
, electrons move from the negative pole and through the P-type semiconductor units
502
, where heat is absorbed, and to the adjacent N-type semiconductor units
501
, where heat is released. At each passage of the electrons through one NP module, there is a transfer of heat from one side to the other, thereby creating a temperature difference at the heat-absorbing and heat-releasing sides. The arrangement of the cooling unit
5
can thus transfer the heat generated by the integrated circuit device
3
via the ceramic sheet
505
at the heat-absorbing side to the ceramic sheet
504
at the heat-releasing side so as to be dissipated to the outside through the use of the fan
4
.
Although the heat-dissipating apparatus of
FIG. 2
provides a better heat-dissipating effect over that of
FIG. 1
, since the integrated circuit device
3
is only in contact with the central portion of the heat-absorbing side, condensation of water droplets may occur at the remaining portion of the heat-absorbing side, where the temperature is likewise relatively low, when exposed to the ambient air. The water droplets may drip to the circuit board
7
therebelow, thereby resulting in short-circuit and shortened service life for the circuit board
7
. Moreover, the dissipation of heat by using air currents generated by the fan
4
is also inefficient since air is not a good heat conductor.
SUMMARY OF THE INVENTION
Therefore, the main object of the present invention is to provide a heat-dissipating apparatus for an integrated circuit device that provides an enhanced heat-dissipating effect and that prevents condensation of water droplets therein.
Accordingly, a heat dissipating apparatus of this invention is adapted to dissipate heat released from a heat-generating side of an integrated circuit device that is mounted on a circuit board. The heat-dissipating apparatus includes a base member, a thermoelectric cooling unit and a washer member. The base member has an upright surrounding wall portion and a top wall. The surrounding wall portion confines a receiving space with an area larger than the integrated circuit device. The top wall is formed on a top end of the surrounding wall portion so as to close a top side of the receiving space. The base member is adapted to be disposed on the circuit board such that the integrated circuit device is accommodated within the receiving space. The top wall has an upper wall surface, and a lower wall surface opposite to the upper wall surface and formed with a serpentine fluid groove that opens downwardly and that has opposing first and second groove ends. The top wall further has a fluid inlet in fluid communication with the first groove end, and a fluid outlet in fluid communication with the second groove end. The thermoelectric cooling unit is disposed in the receiving space below the top wall, and has a heat-absorbing side adapted to be placed in contact with the heat-generating side of the integrated circuit device, and a heat-releasing side opposite to the heat-absorbing side. The cooling unit has a size corresponding to the area of the receiving space, and is adapted to separate the integrated circuit device from the fluid groove. The washer member is disposed in the receiving space below the cooling unit. The washer member has inner and outer peripheral portions, and top and bottom surfaces. The inner peripheral portion is formed with a through hole that is adapted to contain the integrated circuit device therein. The outer peripheral portion establishes a fluid-tight seal with the surrounding wall portion of the base member. The top surface establishes a fluid-tight seal with the heat-absorbing side of the cooling unit. The bottom surface is adapted to establish a fluid-tight seal with the circuit board.
REFERENCES:
patent: 3212274 (1965-10-01), Eidus
patent: 6073449 (2000-06-01), Watanabe et al.
patent: 6233959 (2001-05-01), Kang et al.
patent: 6233980 (2001-05-01), Kang et al.
Brooks & Kushman P.C.
Thompson Gregory
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