Heat dissipating apparatus for a semiconductor device for use in

Details Heat dissipating apparatus for a semiconductor device for use in Heat dissipating apparatus for a semiconductor device for use in

1995-08-23

1997-12-30

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361719, 361720, H05K 720

Patent

active

057037523

ABSTRACT:
A heat dissipating apparatus for a semiconductor device for use in a motor drive that improves heat dissipation efficiency by transferring heat from the semiconductor device directly to a heat sink, using ground leads or nonconnection leads of element lead pins. In addition, it is possible to connect the semiconductor device to the heat sink without extra fixing members

REFERENCES:
patent: 4254447 (1981-03-01), Griffis
patent: 4682269 (1987-07-01), Pitasi
patent: 4764804 (1988-08-01), Sahara et al.
patent: 4945451 (1990-07-01), Gohl et al.
patent: 4965699 (1990-10-01), Jorden et al.
patent: 4974119 (1990-11-01), Martin

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