Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-02-21
2006-02-21
Datskovskiy, Michael (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S709000, C361S710000, C165S080300, C165S185000, C257S706000, C257S707000
Reexamination Certificate
active
07002804
ABSTRACT:
A heat dissipating apparatus for an electronic device having an integrated heat spreader is disclosed. The integrated heat spreader is disposed on the electronic device. The electronic device is inserted into a socket. The heat dissipating apparatus includes a base and at least one fin. The base is connected to the integrated heat spreader and has a concave area. When the base is connected to the integrated heat spreader, a contact area is thereby formed. The shape and position of the contact area correspond to those of the integrated heat spreader. The concave area is formed on the base and extended from the edge of the base to the contact area. The fin is formed on the base.
REFERENCES:
patent: 5241453 (1993-08-01), Bright et al.
patent: 5651688 (1997-07-01), Lin
patent: 402012953 (1990-01-01), None
patent: 405003235 (1993-01-01), None
patent: 534356 (2003-05-01), None
Chung Chao-Tsai
Hsiao Wan-Chin
ASUSTek Computer Inc.
Birch & Stewart Kolasch & Birch, LLP
Datskovskiy Michael
LandOfFree
Heat dissipating apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat dissipating apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipating apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3653578