Heat-dissipating and supporting structure for a plastic package

Details Heat-dissipating and supporting structure for a plastic package Heat-dissipating and supporting structure for a plastic package

1996-12-27

1998-08-11

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257675, 257796, 26427217, 437211, H05K 720

Patent

active

057936137

ABSTRACT:
The present invention relates to a heat-dissipating and supporting structure for a semiconductor electronic device to be encapsulated within a molded plastic material package, of the type having an insulated inner heat sink. In particular, it comprises a heat-sink element which has a first largest surface to be insulated by means of a plastic material layer with a first thickness, and a second largest surface, opposite from the first, to be insulated by means of a layer of plastic material with a second thickness which is thin compared to the first thickness; and a leadframe consisting of a metal strip attached to the heat-sink element on the same side as the first largest surface and comprising a peripheral holder structure located outside the heat-sink element.
Formed in a portion of a side surface of the heat-sink element, is a relief which has mouths located on the first and second largest surfaces of the heat-sink element, the mouth formed on the first largest surface is substantially blocked by an obstructing means which extends to the heat-sink element outside, toward the peripheral holder structure, such as to only leave a slit open between the obstructing means and the peripheral holder structure of the leadframe next to the first largest surface of the heat-sink element. The mouth formed on the second largest surface is open wide.

REFERENCES:
patent: 5105259 (1992-04-01), McShane
patent: 5378924 (1995-01-01), Liang
patent: 5442234 (1995-08-01), Liang
patent: 5608267 (1997-03-01), Mahulikar

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