Heat dispersing method for IC of PC board and its device

Details Heat dispersing method for IC of PC board and its device Heat dispersing method for IC of PC board and its device

1997-10-27

1999-05-11

Thompson, Gregory

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361690, 361715, 361752, H05K7/20

Patent

active

059034351

ABSTRACT:
A heat dispersing method for IC of PC boards has a first step of placing a heat dispersing member having an excellent heat dispersing character and a plastic feature directly on an IC, a second step of transmitting the heat of the IC directly to the heat dispersing member, a third step of positioning and combining the heat dispersing member with a housing of an electronic equipment, a fourth step of transmitting the hat of the heat dispersing member and in the housing through the housing and into open air. The device includes a housing housing, a PC board and a heat dispersing member to disperse out the heat of the IC quickly for prolonging its service life.

REFERENCES:
patent: 4656559 (1987-04-01), Fathi
patent: 5461540 (1995-10-01), Lee
patent: 5461541 (1995-10-01), Wentland, Jr. et al.
patent: 5742472 (1998-04-01), Wu

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