Heat exchange – With coated – roughened or polished surface
Reexamination Certificate
2006-02-07
2006-02-07
Ciric, Ljiljana (Department: 3753)
Heat exchange
With coated, roughened or polished surface
C165S104210, C165S104330, C165S185000, C165S906000, C228S111500
Reexamination Certificate
active
06994153
ABSTRACT:
One object of the present invention is to realize a heat discharger having a high precision and in which heat conduction efficiency is maintained at the bonding between the heat pipe and heat sink. A heat discharger comprises a heat pipe and a heat sink formed separately from the heat pipe and bonded to the heat pipe via solder. The contact surface portion between the heat pipe and the solder and the contact surface portion between the heat sink and the solder are made of a wettable material having a wettablility such that the contacting angle with respect to the solder is 90 degrees or less.
REFERENCES:
patent: 5759707 (1998-06-01), Belt et al.
patent: 60-49862 (1985-03-01), None
patent: 7106479 (1995-04-01), None
patent: 9-42870 (1997-02-01), None
patent: 10-098142 (1998-04-01), None
Richards, B. P., et al., “An Analysis of the Current Status of Lead-Free Soldering”, Jan. 1999.
Fusion Incorporated, “Paste Brazing & Soldering Alloys”, 1996, pp. 1-18 (Document 1).
“Fusion No. 450” (Document 2).
Mitsubishi Electric Corporation, “Satellite-Borne Equipments” (Document 3).
Buchanan & Ingersoll PC
Ciric Ljiljana
Mitsubishi Denki & Kabushiki Kaisha
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