Heat-curing, solvent-free one-component adhesives which are base

Details Heat-curing, solvent-free one-component adhesives which are base Heat-curing, solvent-free one-component adhesives which are base

1997-07-11

1999-02-23

Cameron, Erma

Stock material or miscellaneous articles

Composite

Of polyamidoester

528 45, 528 73, 528 52, 528407, 528905, 427386, 4273881, 1563317, C08G 1880

Patent

active

058741739

ABSTRACT:
Heat-curing, solvent-free one-component adhesives which are based on polyurethanes and which do not give off elimination products, and which are derived from A) a hardener component consisting of polyaddition products containing hydroxyl and uretdione groups, B) a binder component comprising 1,2-epoxide compounds having more than one 1,2-epoxide group and one or more hydroxyl groups in the molecule, C) catalysts for polymerizing epoxide groups, optionally D) further hydroxyl-containing compounds and optionally E) auxiliaries and additives known from adhesives technology; a process for preparing these compounds and to their use as heat-curing, one-component, solvent-free, thermally stable and solvent-resistant polyurethane (PU) adhesives which do not give off elimination products.

REFERENCES:
patent: 3494888 (1970-02-01), McElroy
patent: 4335228 (1982-06-01), Beitchman et al.
patent: 5100995 (1992-03-01), Munzmay et al.
patent: 5410011 (1995-04-01), Konishi et al.

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