Heat curable solventless liquid prepolymer and novel monomer pre

Details Heat curable solventless liquid prepolymer and novel monomer pre Heat curable solventless liquid prepolymer and novel monomer pre

1983-01-21

1985-08-20

Daus, Donald G.

Organic compounds -- part of the class 532-570 series

Organic compounds

Heterocyclic carbon compounds containing a hetero ring...

526259, C07D20948

Patent

active

045365822

ABSTRACT:
A heat curable, solventless liquid prepolymer is prepared from a rubber monomer; a nitrile monomer such as acrylonitrile or methacrylonitrile; and a novel monomer having the following formula: ##STR1## The prepolymer is formed with sufficient chain transfer agent to establish a weight average molecular weight less than about 25,000. This low viscosity prepolymer is heat curable to form a solid rubber polymer suitable for use as a gasket.

REFERENCES:
patent: 2978432 (1961-04-01), Graulich et al.
patent: 2978437 (1961-04-01), Christenson
patent: 3037963 (1962-06-01), Christenson
patent: 3079434 (1963-02-01), Christenson et al.
patent: 3087965 (1963-04-01), Dowbenko et al.
patent: 3108088 (1963-10-01), Krueger
patent: 3118852 (1964-01-01), Christenson et al.
patent: 3206424 (1965-09-01), Heimrich et al.
patent: 3240740 (1966-03-01), Knapp et al.
patent: 3326868 (1967-06-01), Tucker
patent: 3503918 (1970-03-01), LeSota et al.
patent: 4059556 (1977-11-01), Neukam et al.
patent: 4102844 (1978-07-01), Schwinum et al.
patent: 4145500 (1979-03-01), Neukam et al.
patent: 4366291 (1982-12-01), Gunesin et al.

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