Heat-curable silicone resin compositions

Details Heat-curable silicone resin compositions Heat-curable silicone resin compositions

1975-10-17

1976-08-10

Jacobs, Lewis T.

Chemistry of carbon compounds

Miscellaneous organic carbon compounds

260 465UA, 260825, C08L 8304

Patent

active

039741222

ABSTRACT:
A silicone resin molding composition is proposed which comprises (a) a vinyl-containing organopolysiloxane composed of randomly copolymerized tri-, di- and mono-functional siloxane units in specific mole fractions, (b) a vinyl-containing organopolysiloxane with at least one block composed of from 5 to 1,000 of diorganosiloxane units bonded linearly to each other in an uninterrupted sequence, (c) an organohydrogenpolysiloxane which serves as a crosslinking agent and (d) a platinum catalyst. Being solid at room temperature, the silicone resin molding composition of the present invention is suitable for transfer molding and injection molding, and the molded articles obtained from the composition have the advantages of good dimensional stability with very small thermal expansion coefficients as well as small shrinkage in molding and in post-curing.

REFERENCES:
patent: 3699073 (1972-10-01), Wada et al.
patent: 3844992 (1974-10-01), Antonen
patent: 3907742 (1975-09-01), Tanaka et al.

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