Heat-curable silicone composition and light emitting diode...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Polymers from only ethylenic monomers or processes of...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C528S039000

Reexamination Certificate

active

07915362

ABSTRACT:
Provided is a heat-curable silicone composition containing: (A) an organopolysiloxane having at least one structure represented by the following general formula (2) within each molecule:wherein m represents an integer of 0, 1 or 2, R1represents a hydrogen atom, a phenyl group or a halogenated phenyl group, R2represents a hydrogen atom or a methyl group, R3represents an identical or different monovalent organic group having 1 to 10 carbon atoms, and R4represents an identical or different bivalent organic group having 1 to 10 carbon atoms; and (B) a quantity of an organic peroxide that is effective as a curing catalyst. The heat-curable silicon composition yields a cured product having excellent transparency and minimal discoloration over time. Also provided is a light emitting diode element having a material composed of the cured product.

REFERENCES:
patent: 4201808 (1980-05-01), Cully et al.
patent: 4525563 (1985-06-01), Shibata et al.
patent: 4733942 (1988-03-01), Hida et al.
patent: 4886841 (1989-12-01), Hida et al.
patent: 4943613 (1990-07-01), Arai et al.
patent: 5965299 (1999-10-01), Khan et al.
patent: 2005/0129957 (2005-06-01), Kashiwagi et al.
patent: 2006/0270788 (2006-11-01), Ozai et al.
patent: 0 134 678 (1985-03-01), None
patent: 0 378 370 (1990-07-01), None
patent: 1 045 009 (2000-10-01), None
patent: 2137635 (1984-10-01), None
patent: 58-173174 (1983-10-01), None
patent: 62-119141 (1987-05-01), None
patent: 63-186719 (1988-08-01), None
patent: 1-304108 (1989-12-01), None
patent: 3-166262 (1991-07-01), None
patent: 10-228249 (1998-08-01), None
patent: 10-242513 (1998-09-01), None
patent: 11-1619 (1999-01-01), None
patent: 2000-123981 (2000-04-01), None
patent: 2001123120 (2001-05-01), None
patent: 2007-214543 (2007-08-01), None
patent: 2007-314758 (2007-12-01), None
Anonymous, Database IP. Com IPCOM000134301D, Mar. 1, 2006, “Härtbare Siliconmassen für Licht emittierende Dioden (LED)”, XP-002473018.
U.S. Appl. No. 11/763,782, filed Jun. 15, 2007, Matsumoto et al.
Office Action issued Nov. 9, 2010, in Chinese Patent Application No. 200710154338.2, filed Sep. 21, 2007, with English Translation.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Heat-curable silicone composition and light emitting diode... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat-curable silicone composition and light emitting diode..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat-curable silicone composition and light emitting diode... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2699893

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.