Coating processes – Direct application of electrical – magnetic – wave – or... – Polymerization of coating utilizing direct application of...
Reexamination Certificate
2007-01-16
2007-01-16
Peng, Kuo-Liang (Department: 1712)
Coating processes
Direct application of electrical, magnetic, wave, or...
Polymerization of coating utilizing direct application of...
C528S032000, C528S041000, C528S031000, C428S447000
Reexamination Certificate
active
10148034
ABSTRACT:
The invention concerns a silicone/adhesive complex comprising at least a silicone coating applied on a first support and an adhesive coating applied on a second support, and whereof the release force of a silicone/adhesive interface is capable of being modulated. The invention is characterized in that its silicone coating results from heat polymerization and/or curing of: either monomers, oligomers and/or polymers bearing at least a reactive Si—H structural unit and monomers, oligomers and/or polymers bearing at least a reactive unsaturated aliphatic group; or monomers, oligomers and/or polymers bearing at least a reactive Si—OH structural unit; or monomers, oligomers and/or polymers bearing at least a reactive Si—H structural unit and monomers oligomers and/or polymers bearing at least a reactive epoxy, oxetane and/or dioxolane unit; and said silicone coating further comprises at least an additive adjusting the release force of a silicone/adhesive interface and whereof the activity is photochemically initiated and adjustable.
REFERENCES:
patent: 4424254 (1984-01-01), Hedrick et al.
patent: 4526953 (1985-07-01), Dallavia
patent: 4940846 (1990-07-01), Hinterwaldner
patent: 5281656 (1994-01-01), Thayer et al.
patent: 5616629 (1997-04-01), Nguyen et al.
patent: 5891530 (1999-04-01), Wright
patent: 5969025 (1999-10-01), Corzani
patent: 6306475 (2001-10-01), Stocq et al.
patent: 198 31 775 (1999-01-01), None
patent: WO 96 05962 (1996-02-01), None
Dhaler Didier
Guyot Christophe
Lievre Andre
Mirou Christian
Buchanan & Ingersoll & Rooney PC
Peng Kuo-Liang
Rhodia Chimie
LandOfFree
Heat-curable silicone adhesive complex whereof the interface... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat-curable silicone adhesive complex whereof the interface..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat-curable silicone adhesive complex whereof the interface... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3772326