Heat-curable resin composition and use thereof

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Compositions to be polymerized by wave energy wherein said...

Reexamination Certificate

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Details

C522S168000, C522S169000, C526S266000, C526S270000, C526S271000, C528S403000, C528S417000, C528S423000

Reexamination Certificate

active

07098258

ABSTRACT:
The heat-curable resin composition of the present invention comprises an epoxy-containing resin and a curing agent, wherein the curing agent is cyclohexanetricarboxylic acid and/or an anhydride thereof. The heat-curable resin composition exhibits an excellent curability without using an curing accelerator and provides a colorless transparent cured product which is little discolored under high-temperature conditions and irradiation conditions of high-energy light. The heat-curable resin composition is suitable for producing coating compositions, adhesives, shaped articles, protective films for color filters and sealing materials for photosemiconductors such as blue LED and white LED.

REFERENCES:
patent: 3875122 (1975-04-01), Mirolli
patent: 5116892 (1992-05-01), Barbee et al.
patent: 5145987 (1992-09-01), Molzahn
patent: 5786430 (1998-07-01), Kaplan et al.
patent: 2005/0070687 (2005-03-01), Ideno et al.
Communication, with European Search Report, dated Sep. 15, 2004, for No. EP 04 01 4662.

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