Heat curable polyglycidyl aromatic amine encapsulants

Details Heat curable polyglycidyl aromatic amine encapsulants Heat curable polyglycidyl aromatic amine encapsulants

1984-05-09

1985-12-17

Nielsen, Earl

Stock material or miscellaneous articles

Composite

Of epoxy ether

26427213, 26427219, 26433112, 427 58, 427104, 427116, 528 92, 528 94, 528341, B05D 512, C08G 5928

Patent

active

045592721

ABSTRACT:
A highly fluid, solventless heat curable resin is formulated from an admixture comprising a polyglycidyl aromatic amine, a polycarboxylic acid anhydride curing agent, and a curing accelerator. The heat curable formulation exhibits low viscosity and is useful as an encapsulant and insulation for electrical members exposed to high electrical stress. Magnetic coils encapsulated with the cured formulation resist corona discharge at electrical stresses in excess of 2100 volts per mil.

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Dean et al., "Specifying HV Potting Compounds", 15th National SAMPE Technical Conference, Oct. 4-6, 1983, pp. 511-518.
Price et al., "Evaluation Selection of Encapsulating Plastics for Ordnance Electronic Assemblies: Final Report," under Contract DAAK 21-79-C-0017, AD A118714, May 1981.
Kelchner et al., "In Situ Grown Fiber Reinforcement for Improved High Voltage Component Encapsulants," 26th National SAMPE Symposium, Apr. 28-30, 1981, vol. 26, pp. 444-461.

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