Heat-curable compositions comprising low-temperature impact...

Details Heat-curable compositions comprising low-temperature impact... Heat-curable compositions comprising low-temperature impact...

2004-07-16

2011-12-13

Gulakowski, Randy (Department: 1766)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

C525S458000, C525S399000, C525S407000, C156S330000

Reexamination Certificate

active

08076424

ABSTRACT:
The present invention relates to compositions which contain at least one epoxide adduct A having on average more than one epoxide group per molecule, at least one polymer B of the formula (I), at least one thixotropic agent C, based on a urea derivative in a nondiffusing carrier material, and at least one curing agent D for epoxy resins, which is activated by elevated temperature. This composition serves in particular as an adhesive and has an extremely high dynamic resistance to cleavage, in particular at low temperatures.The invention furthermore relates to impact strength modifiers terminated with epoxide groups and of the formula (I). It has been found that these novel impact strength modifiers result in a significant increase in impact strength in epoxy resin compositions, in particular in two-component epoxy resin compositions.

REFERENCES:
patent: 3148167 (1964-09-01), Keplinger, Jr.
patent: 3505283 (1970-04-01), Dalhuisen
patent: 3533983 (1970-10-01), Hirosawa
patent: 4383068 (1983-05-01), Brandt
patent: 4486556 (1984-12-01), Kordomenos et al.
patent: 4952645 (1990-08-01), Mülhaupt et al.
patent: 5073601 (1991-12-01), Mulhaupt et al.
patent: 5079094 (1992-01-01), Kimball
patent: 5151327 (1992-09-01), Nishiyama et al.
patent: 5189081 (1993-02-01), Akutagawa et al.
patent: 5274006 (1993-12-01), Kagoshima et al.
patent: 5278257 (1994-01-01), Mulhaupt et al.
patent: 5290857 (1994-03-01), Ashida et al.
patent: 5350825 (1994-09-01), Konig et al.
patent: 5484853 (1996-01-01), Chen et al.
patent: 5668227 (1997-09-01), Wolleb et al.
patent: 5686509 (1997-11-01), Nakayama et al.
patent: 5707439 (1998-01-01), Takekoshi et al.
patent: 5908911 (1999-06-01), Nakashio et al.
patent: 6077884 (2000-06-01), Hess et al.
patent: 6153709 (2000-11-01), Xiao et al.
patent: 6197849 (2001-03-01), Zilg et al.
patent: 6207733 (2001-03-01), Feola et al.
patent: 6248204 (2001-06-01), Schuft
patent: 6322890 (2001-11-01), Barron et al.
patent: 6548593 (2003-04-01), Merz et al.
patent: 6649706 (2003-11-01), Heid et al.
patent: 6740192 (2004-05-01), Lu et al.
patent: 6903180 (2005-06-01), Kaji et al.
patent: 2002/0007003 (2002-01-01), Merz et al.
patent: 2002/0061970 (2002-05-01), Sawada
patent: 2003/0105266 (2003-06-01), Suga
patent: 2005/0209401 (2005-09-01), Lutz et al.
patent: 2007/0066721 (2007-03-01), Kramer et al.
patent: 2007/0105983 (2007-05-01), Kramer et al.
patent: 2008/0073029 (2008-03-01), Kramer
patent: 2009/0264558 (2009-10-01), Kramer et al.
patent: 2009/0288766 (2009-11-01), Kramer et al.
patent: 2009/0324958 (2009-12-01), Schulenburg et al.
patent: 197 51 143 (1998-05-01), None
patent: 199 24 170 (2000-11-01), None
patent: 0 338 985 (1989-10-01), None
patent: 0 338 995 (1989-10-01), None
patent: 0 343 676 (1989-11-01), None
patent: 0 343 676 (1989-11-01), None
patent: 0 343 686 (1989-11-01), None
patent: 0 353 190 (1990-01-01), None
patent: 0 600 314 (1994-06-01), None
patent: 1 152 019 (2001-11-01), None
patent: 1 359 202 (2003-11-01), None
patent: 1 431 325 (2004-06-01), None
patent: 1 498 441 (2005-01-01), None
patent: 1 326 669 (1973-08-01), None
patent: 2 314 085 (1997-12-01), None
patent: 2000-212504 (2000-08-01), None
patent: WO 00/37520 (2000-06-01), None
patent: WO 00/37554 (2000-06-01), None
patent: WO 01/23466 (2001-04-01), None
patent: WO/02/48235 (2002-06-01), None
patent: WO 03/093387 (2003-11-01), None
patent: WO 2004/055092 (2004-07-01), None
patent: WO 2005/007720 (2005-01-01), None
patent: WO 2005/007766 (2005-01-01), None
patent: WO 2005/007766 (2005-01-01), None
Non-Final Rejection in U.S. Appl. No. 12/311,046 mailed Nov. 2, 2009.
International Search Report for International Application No. PCT/EP2007/056598 mailed Aug. 29, 2007.
International Search Report for International Application No. PCT/EP2006/063891 mailed Sep. 25, 2006.
Derwent accession No. 2001-062546 for German Patent No. 19,924,170 and U.S. Patent No. 6,649,706, Heid et al., Nov. 30, 2000, one page.
Derwent accession No. 2002-124066 for European Patent No. 1/152,019 and U.S. Patent No. 6,548,593, Merz et al., Nov. 7, 2001, one page.
Non-Final Rejection in U.S. Appl. No. 11/976,991 mailed Nov. 3, 2009.
International Search Report for International Application No. PCT/EP/03/14382 mailed Apr. 7, 2004.
Non-Final Rejection mailed Nov. 18, 2009 in U.S. Appl. No. 10/538,877.
International Search Report for International Application No. PCT/EP2007/061416, filed Feb. 6, 2008.
Office Action in U.S. Appl. No. 11/988,290 mailed Dec. 28, 2010.
Notice of Allowance in U.S. Appl. No. 11/988,290, mailed Jun. 28, 2011.

Affiliated with

Also associated with

Rating

Heat-curable compositions comprising low-temperature impact... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat-curable compositions comprising low-temperature impact..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat-curable compositions comprising low-temperature impact... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4295624