Heat curable blends of silicone polymide and epoxy resin

Details Heat curable blends of silicone polymide and epoxy resin Heat curable blends of silicone polymide and epoxy resin

1992-02-18

1992-12-08

Foelak, Morton

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

524188, 528 26, 528 38, C08F28300, C08G 5914

Patent

active

051699117

ABSTRACT:
Heat curable dielectric compositions are provided comprising blends of silicone polyimide and epoxy resin and an effective amount of an arylonium salt such as a diaryliodoniumhexafluoroantimonate in combination with a free radical generating aromatic compound as a cocatalyst.

REFERENCES:
patent: 4497728 (1985-02-01), Yoshimura et al.
patent: 4598135 (1986-07-01), Buese
patent: 4826916 (1989-05-01), Policastro et al.
patent: 5064882 (1991-11-01), Walles et al.

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