Heat-curable bismaleimide-alkenyl heterocyclic molding material

Details Heat-curable bismaleimide-alkenyl heterocyclic molding material Heat-curable bismaleimide-alkenyl heterocyclic molding material

1989-07-26

1991-03-26

Anderson, Harold D.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Polymers from only ethylenic monomers or processes of...

526263, 528170, 528322, C08F 2240

Patent

active

050030175

ABSTRACT:
Heat-curable bismaleimide resins contain a bismaleimide and a heterocyclic comonomer having terminal alkenyl or alkenyloxy groups. A preferred comonomer is 2,6-bis-(2-propenylphenoxy)-pyridine. The bismaleimide resins are suitable for the production of high performance composites.

REFERENCES:
patent: 3742141 (1988-05-01), Dien et al.
patent: 4849485 (1989-07-01), Pockett
patent: 4921931 (1990-05-01), Wang

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