Heat-curable adhesive composition

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C524S274000

Reexamination Certificate

active

07358289

ABSTRACT:
The present invention provides a heat-curable adhesive composition comprising ethylene-glycidyl (meth)acrylate copolymer, low density polyethylene, ethylene-a-olefin copolymer, and a heat curing agent for the ethylene-glycidyl (meth)acrylate copolymer.

REFERENCES:
patent: 5548012 (1996-08-01), Yamamoto et al.
patent: 6335076 (2002-01-01), Nakamura et al.
patent: 6590070 (2003-07-01), Toriumi et al.
patent: 0 289 632 (1988-11-01), None
patent: 0 348 200 (1989-12-01), None
patent: 0 721 975 (1996-07-01), None
patent: 2-180979 (1990-07-01), None
patent: 2-261876 (1990-10-01), None
patent: 4-8766 (1992-01-01), None
patent: 4-227982 (1992-08-01), None
patent: 5-17735 (1993-01-01), None
patent: 5-295126 (1993-11-01), None
patent: 9-25371 (1997-01-01), None
patent: 10-81815 (1998-03-01), None
patent: 10-316955 (1998-12-01), None
patent: 2000-290627 (2000-10-01), None
patent: WO 00/00566 (2000-01-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Heat-curable adhesive composition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat-curable adhesive composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat-curable adhesive composition will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2746245

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.