Heat-curable adhesive

Details Heat-curable adhesive Heat-curable adhesive

1994-01-11

1995-07-18

Michl, Paul R.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

524445, 524495, 523149, 523156, 523158, C08K 318, C08K 322, C08J 514

Patent

active

054342112

ABSTRACT:
Heat-curable adhesive in powder form and solvent-free, containing a mixture of solid phenolic resin with latent hardener in combination with an inorganic pigment mixture.

REFERENCES:
patent: 1606943 (1926-11-01), Huxham
patent: 3896081 (1975-07-01), Baxter et al.
patent: 3910857 (1975-10-01), Phillips
patent: 4075155 (1978-02-01), Phillips
patent: 4105604 (1978-08-01), Vargiu et al.
patent: 4216133 (1980-08-01), Johnson et al.
patent: 4226759 (1980-10-01), Chester
patent: 4268657 (1981-05-01), Manzara
patent: 4539343 (1985-09-01), Nishimura
patent: 4596845 (1986-06-01), Koyama et al.
patent: 4925887 (1990-05-01), Gunther et al.
JP-A-58029850, Matsushita Denko, "Resin Modling Material", Abstract.
JP: 59108072, Nitto Electric; Derwent Pub. AN-84-191797 Abstract.
JP: 53061645, Matsushita, Derwent Pub. AN 78-50377A; Abstract.
Article, Konstruktion 29 (1977) H.11, p. 466.
R. Hinterwalnder, "Mineralische Fullstoffe in Leimen, Klebstoffen . . . ", Adhasion, 11. Jahrgang (1967) magazine 6, pp. 252-262.
K. F. Schroeder, "Neuere Erkenntnisse bei der Auswahl und Anwwendung . . . ", Part I, Adhasion, 1971, magazine 3, pp. 72-94.

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