Heat-control process and apparatus for attachment/detachment of

Details Heat-control process and apparatus for attachment/detachment of Heat-control process and apparatus for attachment/detachment of

1995-02-24

1996-09-10

Elpel, J.

Metal fusion bonding

Process

With condition responsive, program, or timing control

228 9, H05K 334, B23K 100

Patent

active

055537685

ABSTRACT:
Process, apparatus and nozzle device for controlling the soldering and/or desoldering of a land grid array (LGA) component and corresponding circuit grid present on the surface of a printed circuit board (PCB). The nozzle device comprises a vacuum cup for supporting the LGA parallel to the PCB, with the LGA and the circuit grid in contact or slightly spaced, a fixed orifice gap for directing hot inlet gas from a gas source horizontally through the array, a gas outlet, and a thermocouple for sensing the temperature of the hot outlet gas and for signaling a computer to actuate a heater and a flow rate regulator. According to a preferred embodiment, this increases the temperature and decreases the flow rate of the hot gas through the array when a predetermined gas outlet temperature is sensed at the thermocouple. Uniform slower circulation of the hotter gas is continued for the desired dwell time to produce uniform, simultaneous melting of the solder array to permit bonding to or desoldering from the circuit array of the PCB while supporting the component parallel to the PCB.

REFERENCES:
patent: 4552300 (1985-11-01), Zovko et al.
patent: 4564135 (1986-01-01), Barresi et al.
patent: 4752025 (1988-06-01), Stach et al.
patent: 4767047 (1988-08-01), Todd et al.
patent: 4787548 (1988-11-01), Abbagnaro et al.
patent: 5044072 (1991-09-01), Blais et al.
patent: 5152447 (1992-10-01), Wallgren et al.
"Rework Fixture For Surface-Mounted Components", IBM Technical Disclosure Bulletin. vol. 29, No. 11, Apr. 1987, pp. 4718-4719.

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