Heat conductive substrate mounted in PC board for transferring h

Details Heat conductive substrate mounted in PC board for transferring h Heat conductive substrate mounted in PC board for transferring h

1996-10-09

1998-10-20

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257717, 257720, 361705, H05K 720

Patent

active

058256253

ABSTRACT:
A heat conductive substrate is mounted within a through-opening of a printed circuit board. An integrated circuit then is mounted to one side of the heat conductive substrate, while a heat sink is fixed in thermal contact to the other side of the substrate. There is no direct thermal contact between the IC and the PC board. The substrate is mounted to an undersurface of the PC board and concentrically spaced from the PC board within the opening. An air gap occurs between the substrate and the PC board within the opening to substantially reduce heat conductivity into the PC board.

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