Heat conductive silicone composition

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...

Reexamination Certificate

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C524S437000, C525S477000, C525S478000, C525S479000, C528S015000, C528S024000, C528S031000, C528S032000

Reexamination Certificate

active

07737212

ABSTRACT:
A heat conductive silicone composition is provided, which includes (A) an organopolysiloxane having the formula (1):in-line-formulae description="In-line Formulae" end="lead"?{(CH2═CH)R12SiO1/2}L(R1SiO3/2)m(R12SiO)n{O1/2SiR12—R2—SiR1(3-a)(OR3)a}o  (1)in-line-formulae description="In-line Formulae" end="tail"?wherein R1represents monovalent hydrocarbon groups, R2represents an oxygen atom or a bivalent hydrocarbon group, R3represents an alkyl group, alkoxyalkyl group, alkenyl group, or acyl group, L and o represent numbers from 1 to 10, m represents a number from 0 to 10, n represents a number from 5 to 100, a represents an integer from 1 to 3, and when m=0, L+o=2 and R2is a bivalent hydrocarbon group, (B) a heat conductive filler, and (C) an organopolysiloxane other than the component (A). Even upon high-level packing with the heat conductive filler to obtain a highly heat conductivity, the composition still exhibits favorable handling and moldability properties.

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U.S. Appl. No. 11/859,123, filed Sep. 21, 2007, Ozai.

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