Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...
Patent
1997-11-06
1999-06-01
Michl, Paul R.
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Processes of preparing a desired or intentional composition...
252514, 523458, C08K 308
Patent
active
059088818
ABSTRACT:
The object of the present invention is to provide a paste for bonding a semiconductor, which has excellent low stress and excellent heat conductivity and is useful industrially. The object has been achieved by a heat-conductive paste comprising
(A) an epoxy resin which is liquid at room temperature and which has at least two epoxy groups in the molecule,
(B) an epoxy group-containing reactive diluent having a viscosity of 100 cp or less at room temperature,
(C) a phenolic compound as a curing agent represented by the following general formula (1), which is crystalline at room temperature: ##STR1## wherein R is hydrogen atom or an alkyl group of 1-5 carbon atoms, and (D) a silver powder,
wherein the amount of the silver powder (D) is 70-90% by weight of the total paste; the silver powder (D) contains an atomized silver powder consisting of flake-shaped particles having longitudinal lengths ranging from 10.mu. to 50.mu. and thicknesses ranging from 1.mu. to 5.mu., in an amount of at least 30% by weight of the total silver powder; and the paste is produced by first melt-mixing the component (C) with the components (A) and (B) or with the component (B), and then kneading the resulting mixture with the component (D) or with the components (D) and (A).
REFERENCES:
patent: 4450471 (1984-05-01), Wellhoefer et al.
patent: 4732702 (1988-03-01), Yamazaki
patent: 5180523 (1993-01-01), Durand
patent: 5183592 (1993-02-01), Ichimura
patent: 5575956 (1996-11-01), Hermansen
Database WPI, , Week 9539, Derwent Publication Ltd., London, GB, AN 295079, XP002072647 "electric conducting resin paste comprise silver powder polyepoxide resin compound contain phenolic hydroxy group" (abstract) & JP 07179833 A.
Michl Paul R.
Sumitomo Bakelite Company Limited
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